Global Semiconductor Manufacturing Equipment Market
Semiconductor Manufacturing Equipment Market- By Front-End Equipment, Back-End Equipment, Fab Facility Equipment, Product Type, Dimensions, Participants and Region.
The Global Semiconductor Manufacturing Equipment Market is valued at USD 101.52 Billion in the year 2022 and is projected to reach a value of USD 187.91 Billion by the year 2030. The Global Market is forecasted to grow exhibiting a Compound Annual Growth Rate (CAGR) of 8.00% over the forecast period.
Semiconductor Manufacturing Equipment Market Size, 2022 To 2030 (USD Billion)
Semiconductor Manufacturing Equipment is used to create semiconductor circuits, memory chips, and other components. Semiconductors are materials in which free electrons can easily pass between atoms, allowing electricity to flow more freely. Wafer fabrication equipment is employed early in the semiconductor manufacturing process, followed by testing and assembly equipment. Front-end and back-end Semiconductor Manufacturing Equipment are two of the most often used. These machines have numerous advantages, including streamlined production, increased output and reliability, reduced design and manufacturing errors, and greater worker safety. As a result, they are widely used in the production of products for a variety of industries, including automotive, electronics, robotics, and so on.
Report Coverage & Deliverables
- Real-Time Data Updates:
- Competitor Benchmarking
- Market Trends Heatmap
- Custom Research Queries
- Market Sentiment Analysis
- Demographic and Geographic Insights
The growing need for electronics and gadget solutions has primarily benefited the expansion of the Semiconductor Manufacturing Equipment industry. Factors such as increased investments in R&D facilities as a result of the covid-19 influence, rising demand for electric and hybrid vehicles, the trend of miniaturization and technology migration, and the high demand for chips to provide computation power and connectivity for AI functions are expected to drive the growth of the Semiconductor Manufacturing Equipment Market during the forecast period.
Furthermore, as the penetration of IoT devices grows due to the covid-19 pandemic, the growing need for silicon-based sensors for IoT devices, the spread of chip industries in emerging markets, the increasing number of data centers and servers complemented by the eruption of covid-19, the developing market for developed packaging products, and the manufacturing of equipment are factors that may extend profitable opportunities in the growth of the semiconductor manufacturing.
The Semiconductor Manufacturing Equipment Market is segmented on the basis of Front-End Equipment, Back-End Equipment, Fab Facility Equipment, Product Type, Dimension, and Supply Chain Participant. On the basis of front-end equipment, the market is segmented into Lithography Equipment, Water Surface Conditioning Equipment, Wafer Cleaning Equipment, Deposition Equipment, and Other Front-End Equipment. On the basis of back-end equipment, the market is segmented into Assembly and Packaging, Dicing, Metrology, Bonding, and Water Testing. On the basis of fab facility equipment, the market is segmented into Automation Equipment, Chemical Control Equipment, Gas Control Equipment, and Others. On the basis of product type, the market is segmented into Memory, Foundry, Logic, MPU, Discrete, Analog, MEMS, and Others. On the basis of Dimension, the market is segmented into 2D ICs, 2.5D ICs, and 3D ICs. On the basis of Supply Chain Participant, the market is segmented into IDM Firms, OSAT Companies, and Foundries.
Below tree is interactive. You can click the nodes to get more information.
Based on Dimensions:
In the near future, the 3D category is expected to grow the fastest and will drive the semiconductor manufacturing machines industry. This growth can be attributable to technology advancements, such as 3D integrated circuits (IC), which provide increased performance. Furthermore, it is expected that the design of 3D integrated circuits will emerge as a promising approach for overcoming the limits associated with conventional geometrical scaling. Shorter connector lengths and greater reusability are provided by the 2.5D and 2D dimensions, resulting in reduced time and system cost. This factor is driving the growth of the Semiconductor Manufacturing Equipment Market.
Based on Supply Chain Participants
The integrated device manufacturer (IDM) segment will account for more than 45% of the revenue share in the Semiconductor Manufacturing Equipment Market. Increased investments by IDM firms in R&D operations to create technically complex semiconductor ICs, sensors, RFID circuits, and systems on chips are ascribed to the sector's advancement. These companies are collaborating with Semiconductor Manufacturing Equipment providers to increase their IC production capability. Participants in the industry are also working to improve their IC manufacturing facilities, which will raise market demand for semiconductor manufacturing equipment.
Key players operating in the Global Semiconductor Manufacturing Equipment Market include Tokyo Electron Limited (Japan), Lam Research Corporation (US), ASML (Netherlands), Applied Materials Inc. (US), KLA Corporation (US), Screen Holdings Co. Ltd. (Japan), Teradyne US), Advantest (Japan), Hitachi High-Tech Corporation (Japan), Plasma-Therm (US), Veeco Instruments (US), EV Group (Austria), Onto Innovation (US), Nordson (US), Advanced Dicing Technologies (Israel), QP Technologies (US), Evatec (Switzerland), Modutek Corporation (US), Nikon Corporation (Japan), Semiconductor Equipment Corporation (US), Daifuku (Japan), FormFactor (US), Canon (Japan), Semes (Republic of Korea), Kokusai Electric Corporation (Japan) and others.
Segmentation of the Global Semiconductor Manufacturing Equipment Market:
- Front-End Equipment (Lithography Equipment, Water Surface Conditioning Equipment, Wafer Cleaning Equipment, Deposition Equipment, Others)
- Back-End Equipment (Dicing, Metrology, Bonding, Water Testing)
- Fab Facility Equipment (Automation Equipment, Chemical Control Equipment, Gas Control Equipment, Others)
- Product Type (Memory, Foundry, Logic, MPU, Discrete, Analog, MEMS, Others)
- Dimensions (2D ICs, 2.5D ICs, 3D ICs)
- Participants (IDM Firms, OSAT Companies, Foundries)
- Region (North America, Europe, Asia Pacific, Latin America, Middle East & Africa)
|Regions & Countries Covered
- North America - (U.S., Canada, Mexico)
- Europe - (U.K., France, Germany, Italy, Spain, Rest Of Europe)
- Asia Pacific - (China, Japan, India, South Korea, South East Asia, Rest Of Asia Pacific)
- Latin America - (Brazil, Argentina, Rest Of Latin America)
- Middle East & Africa - (GCC Countries, South Africa, Rest Of Middle East & Africa)
- Tokyo Electron Limited (Japan)
- Lam Research Corporation (US)
- ASML (Netherlands)
- Applied Materials Inc. (US)
- KLA Corporation (US)
- Screen Holdings Co. Ltd. (Japan)
- Teradyne US)
- Advantest (Japan)
- Hitachi High-Tech Corporation (Japan)
- Plasma-Therm (US)
- Veeco Instruments (US)
- EV Group (Austria)
- Onto Innovation (US)
- Nordson (US)
- Advanced Dicing Technologies (Israel)
- QP Technologies (US)
- Evatec (Switzerland)
- Modutek Corporation (US)
- Nikon Corporation (Japan)
- Semiconductor Equipment Corporation (US)
- Daifuku (Japan)
- FormFactor (US)
- Canon (Japan)
- Semes (Republic of Korea)
- Kokusai Electric Corporation (Japan)
||Market growth drivers, restraints, opportunities, Porter’s five forces analysis, PEST
analysis, value chain analysis, regulatory landscape, technology landscape, patent analysis, market
attractiveness analysis by segments and North America, company market share analysis, and COVID-19
Pricing and purchase options
||Avail of customized purchase options to meet your exact research needs. Explore purchase options