Optoelectronic Components Market

High Raw Material Prices to Hamper Growth of Optoelectronic Components Market

Although demand for Optoelectronic Components is growing, price competition among manufacturers has become increasingly intense. Owing to such factors as high component prices and low profit margin, many optoelectronic component manufacturers have yet to break even. Demand growth cannot keep up with supply due to insufficient research and development efforts and production capacity limitations. Additionally, the cost of raw materials has increased, lowering the profitability of many companies.

Segmentation

On the basis of component, the market is segmented into sensor, LED, laser diode, Infrared Components. Based on application, measurement, lighting, communications, security & surveillance, others (geographical survey, scanning, and spectrometry). On the basis of material, the market is segmented into gallium nitride, gallium arsenide, silicon carbide, and others.

Gallium Nitride Key is Material Used for Production of Optoelectronic Components

Gallium Nitride (GaN) is a semiconductor alloy composed of gallium, nitrogen, aluminum, and hydrogen. It is the key material used to create Optoelectronic Components such as vertical transistors (FETs), light-emitting diodes (LEDs), blue laser diodes, photo detectors, ultraviolet LEDs, etc., which are growing in use across various end-use applications including mobile devices, smart home, automotive lighting systems, healthcare, etc. Gallium Nitride (GaN) wafer technology is the key material and production technology for Optoelectronic Components. High purity gallium nitride crystal material with low dislocation density and uniformity are required for high-power light-emitting diodes (LEDs) and photo detectors, whereas low resistivity epitaxial gallium nitride films are essential for fabrication of vertical transistors (FETs).

Asia Pacific to Continue Holding Dominance over Global Optoelectronic Components Market

In the next seven years, demand for Optoelectronic Components will likely increase due to growth in various end-use applications such as mobile devices and automotive lighting systems. In particular, GaNS technology is expected to show strong growth through use of its higher efficiency conversion rate compared with SiC-FETs. Moreover, semiconductor companies are expanding their production capacity both domestically and abroad. As a result, high growth is not expected except in China over the next five years.

Demand growth cannot keep up with supply due to insufficient research and development efforts and production capacity limitations. Additionally, the cost of raw materials has with increased, lowering the profitability of many companies. There is also a risk of oversupply due to rapid expansion of semiconductor production and an increase in market entrants

Competitive Landscape

Due to increasing production capacity, more Chinese players are expected to enter the optoelectronic component market; however, many small-sized players still lag behind larger competitors owing to low brand recognition, lack of research and development funding, sub-par production facilities, or slow product development cycles. Such deficiencies are expected to limit the ability of smaller players to expand their market share.

Osram (Germany), Hamamatsu (Japan), TT Electronics (UK), ON Semiconductor (US), Vishay (US), SICK AG (Germany), Cree (US), Trumpf (Germany), Samsung (South Korea), Broadcom (US), and Sony (Japan) are of the major players in the global Optoelectronic Components market.

The Optoelectronic Components is Segmented as Follows: