System in Package Market is Here to Stay and Boom Over Period of Forecast
System in Package (SiP) market is expected to reach USD 16.70 Billion by 2028 and is currently valued at USD 8.68 Billion. It will grow at a Compound Annual Growth Rate (CAGR) of 9.8%. System in the package has come to be associated with technologies ranging from high-end, die-to-die, chipset-type, advanced integration to devices found in mobile phones that have boosted integration and functionality by employing best-in-class advanced packaging methods. The small and compact packaging is suited for mobile cellular devices. SiP gives designers flexibility and independence in terms of acquiring die and passive components for best-in-class cost and performance benefits. With the growth of SiP devices, several device wafers have used flip-chip bumping or ball drop methods, which can be conveniently joined in SiP packages, rather than wire bonding. In terms of technology and a roadmap, the SiP platform continues to push the boundary in the race to produce denser, thinner, and smaller form factors. These new process technologies include double-side molding technologies that eliminate the underfill operation from the bottom die resulting in an improved cost structure and manufacturing efficiencies.
Rapid research and development, as well as technical advancements, have generated a demand for dependable and small electronic gadgets. As a result, there is an increasing need for smaller electronic devices. With the advancement of semiconductor technology, many electronic goods have grown more complex, necessitating the usage of IC packaging technologies in logic, memory, RF, and sensors to be integrated into compact form factors. The SiP provides high-performance, low-power-consumption solutions in compact packages. The SiP technique enables the integration of various multichip modules, such as DRAM and others, with little interference. SiP allows for extremely dense multilayer integration per unit footprint. While this is appealing for many applications where downsizing is a consideration, it also introduces new issues for thermal control. High on-chip temperature is caused by increased integration. An overheating issue was noticed during the manufacture of 3D ICs using TSVs. When the temperature rises, the threshold voltage falls and mobility suffers. As the component's metal content grows, so does its resistance and power dissipation. Wire resistance rises as well, resulting in longer connection delays. With the availability of high-bandwidth technology, wireless networks will encounter severe congestion during the next five years. This would accelerate the transition from present 3G and 4G LTE technologies to 5G. The aggregate data rates offered by 5G technology are predicted to be far quicker than the present 3G and 4G data rates.
The supply chain management is a significant difficulty for the SiP industry since the "one size fits all" approach is not applicable in this sector. As a result, the market expects a consistent and well-defined supply chain. Because SiP is a developing market, certain procedures in its supply chain, such as product and service breakdown traceability, and logistics, are not standardized. The 3D IC packaging business is confronted with technological obstacles; for example, heterogeneous packaging necessitates testing of all individual die, which may not be performed on the same infrastructure.
The System in Package Market follows three technologies such as 2D IC, 2.5D IC, and 3D IC. On the basis of package type, the market is segmented into ball grid array, surface mount package, pin grid array, flat package, and small outline package. The market depends upon packaging methods like fan-out wafer-level packaging, wire bond & die-attach, and flip-chip. Based on application, the market is divided into automotive & transportation, consumer electronics, communication, industrial, aerospace & defense, healthcare, emerging, and others. The System in the Package Market is distinguishable on the basis of devices. This includes RF front end, RF power amplifier, power management integrated circuits, baseband processor, application processor, microelectromechanical system. The global market for systems in packages is spread over North America, Europe, Asia Pacific, and the rest of the world.
The market for System in Package technology is competitive, with a few competitors such as - Amkor Technology (US), ASE Group (Taiwan), SPIL (Taiwan), UTAC (Global A&T Electronics) (Singapore), and Powertech Technology (Taiwan).
Browse the full Report - System In Package Market by Packaging Technology (2D IC, 2.5D IC, 3D IC), by Package Type (BGA, SOP), by Packaging Method (Flip chip, Wire bond.), by Device (RF front-end, RF amplifier), by Application (Consumer electronics, Communications), by Region (North America, Europe, Asia Pacific, Middle East & Africa) - Global Industry Assessment (2016 - 2021) & Forecast (2022 - 2028)