The Global Non-UV Dicing Tapes Market was valued at USD 1575.55 Million in 2022 and is projected to reach a value of USD 2436.38 Million by 2030. The Global Market is anticipated to grow to exhibit a Compound Annual Growth Rate (CAGR) of 5.60% over the forecast period.
The Non-UV Dicing Tapes are employed in the wafer back grinding process, which is gaining much traction in semiconductor fabrication. Without incurring higher switching costs, thin wafers considerably aid in producing energy-efficient end products. The Non-UV Dicing Tapes are employed in the wafer back grinding process, which is gaining much traction in semiconductor fabrication. Without incurring higher switching costs, thin wafers considerably aid in producing energy-efficient end products. However, the rising demand for semiconductor manufacturing significantly impacts the need for Non-UV Dicing Tapes. Due to the simplicity of removing chips from wafers following the dicing process, Non-UV Dicing Tapes are becoming increasingly popular among semiconductor makers. Furthermore, due to technical developments, the size of chips or ICS in electrical products decreases less quickly. As a result, IC producers are driving the market for Non-UV Dicing Tapes.
Non-UV Dicing Tapes Market Size, 2022 To 2030 (USD Million)
During the projected period, an increase in durable electronic devices is anticipated to drive up demand for Non-UV Dicing Tapes. Furthermore, manufacturers are thinning their wafers because of technological advancements and rising consumer demand for attractively thin electronic items. As a result, during the predicted period, there is an increase in demand for Non-UV Dicing Tapes. In the upcoming years, there should be potential for producers of Non-UV Dicing Tapes due to the rise in demand for electrical and electronic devices. The increased demand for goods like computers and electrical appliances is to blame. As a result, it has increased the demand for semiconductors and PCBs. As a result, during the forecast period, the market is anticipated to see a positive outlook regarding Non-UV Dicing Tapes.
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The Non-UV Dicing Tapes Market is segmented on the basis of Material, Thickness, Coating Type, Application, and Region. Based on the Material, the market is sub-segmented as PVC, PET, PO, and Other Materials. Furthermore, based on Thickness, the market is sub-segmented as 85-125 Micron, 126-150 Micron, Below 85 Micron, and Above 150 Micron. Moreover, based on Coating, the market is sub-segmented as Single Sided and Double Sided. Finally, based on Application, the market is sub-segmented as Wafer Dicing, Package Dicing, and Other Applications.
Based on Material:
On the basis of Material, the PET sub-segment is the most frequently utilized Material for producing Non-UV Dicing Tapes, owing to its benefits, such as lightweight, stability, adequate barrier protection, and high-pressure resistance. As a result, Wafer Dicing applications frequently use Non-UV Dicing Tapes.
Based on Application:
On the basis of the Application, the Wafer Dicing is that equipment for processing wafers includes Wafer Dicing equipment. Lighter wafers are forcing a sudden increase in the integration of microelectronics into various consumer electronics and smart cards. It is believed that the main markets for very thin wafers are RFID, MEMS, and power devices. In particular, processing and dicing, which are crucial steps in creating ultra-thin wafers, are demanded better manufacturing processes due to this scenario. A thin slice of semiconductor material is known as a wafer. Both the production of integrated circuits and photovoltaics for conventional Wafer-Based solar cells employ this Material. Slicing a wafer involves separating individual silicon chips from one another.
Asia Pacific is projected to Grow at the Fastest CAGR during the Forecast Period
Asia Pacific is accounted to grow at the fastest Compound Annual Growth Rate (CAGR) during the forecast period. The Asia Pacific region offers lucrative growth potential for Non-UV Dicing Tapes during the projected period. Demand for dicing tapes is brought on by the increase in the use of tiny semiconductors. Developing nations like India, Brazil, and others have a rising demand for Non-UV Dicing Tapes. A growing number of well-known packaging businesses are considering establishing a manufacturing presence in these nations. Additionally, developing countries import PCBs and semiconductors to manufacture electronic products.
The key players in the Global Non-UV Dicing Tapes Market include- Pantech Tape Co. Ltd., Furukawa Electric Co. Ltd., Mitsui Chemicals Inc., AI Technology Inc., LINTEC Corporation, Pantech Tape Co. Ltd, QES GROUP BERHAD and others.
Segmentation of the Global Non-UV Dicing Tapes Market:
- Material Type (PVC, PET, PO, Other Types)
- Thickness (85-125 Micron, 126-150 Micron, Below 85 Micron, Above 150 Micron)
- Coating Type (Single Sided, Double Sided)
- Application (Wafer Dicing, Package Dicing, Other Applications)
- Region (North America, Europe, Asia Pacific, Latin America, Middle East & Africa)
|Regions & Countries Covered
- North America - (U.S., Canada, Mexico)
- Europe - (U.K., France, Germany, Italy, Spain, Rest Of Europe)
- Asia Pacific - (China, Japan, India, South Korea, South East Asia, Rest Of Asia Pacific)
- Latin America - (Brazil, Argentina, Rest Of Latin America)
- Middle East & Africa - (GCC Countries, South Africa, Rest Of Middle East & Africa)
- Pantech Tape Co. Ltd.
- Furukawa Electric Co. Ltd.
- Mitsui Chemicals Inc.
- AI Technology Inc.
- LINTEC Corporation
- Pantech Tape Co. Ltd
- QES GROUP BERHAD
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analysis, value chain analysis, regulatory landscape, technology landscape, patent analysis, market
attractiveness analysis by segments and North America, company market share analysis, and COVID-19
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